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吉予彤
吉予彤
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关注领域：高等教育
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吉予彤
https://t.docin.com/anglico

关注领域：高等教

她还没有介绍自己~

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吉予彤
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Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder 3 p
Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder
Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys 6 p
Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys
Electromigration damage characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy2667-z 10 p
Electromigration damage characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy2667-z
Characterization of stress-strain response of lead-free solder joints using a digital image correlation technique and finite-element modeling 10 p
Characterization of stress-strain response of lead-free solder joints using a digital image correlation technique and finite-element modeling
Reliability behavior of lead-free soldered joints in electronic components 19 p
Reliability behavior of lead-free soldered joints in electronic components
Structure and properties of lead-free solders bearing micro and nano particles 32 p
Structure and properties of lead-free solders bearing micro and nano particles
2009年江苏省教师岗前培训资料(四门课笔记)[1] 40 p
2009年江苏省教师岗前培训资料(四门课笔记)[1]
001.高等教育学 5 p
001.高等教育学
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